发明名称 PROCESSING DEVICE AND PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To maintain high cleaning capability, without rotating a wafer at the time of cleaning after being developed, and further to restrict the quantity of cleaning solution consumed. SOLUTION: A charged rod 173, which moves on a wafer W retained by a chuck 120, is provided in a developing device 30. Developer is filled on the wafer W, and if a prescribed time period has passed, the charged rod 173 is charged with reverse electric charges to those of a processing products in the developer, while being moved in the developer on the wafer W. When this takes place, the processing products in the developer are gathered by the charged rod 173 by static electricity. As a result, thereafter, even if the cleaning solution for the wafer W is supplied with non-rotatingly, a small quantity is used for the cleaning solution, the wafer W can be cleaned sufficiently. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006066799(A) 申请公布日期 2006.03.09
申请号 JP20040250340 申请日期 2004.08.30
申请人 TOKYO ELECTRON LTD 发明人 SATO NORIKATSU
分类号 H01L21/027;G03F7/30 主分类号 H01L21/027
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