| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and method by which processing liquid is efficiently recovered. SOLUTION: The rotating speed of a wafer W is decreased to 500 rpm from 1500 rpm in the course of supplying a first chemical to the wafer W. In response to the speed-down, a position of a splash guard 18 is changed from the position on which the first chemical is caught to a position under which the first chemical is caught. At the former position, the first chemical splashed from the wafer W rotating at the rotating speed of 1500 rpm is caught most efficiently at a first recovering/catching port 44, while at the latter position, the first chemical splashed from the wafer W rotating at the rotating speed of 500 rpm is caught most efficiently at the first recovering/catching port 44. COPYRIGHT: (C)2006,JPO&NCIPI
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