发明名称 SUBSTRATE-PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate-processing apparatus, by which heat distortion due to welding between a reaction tube constituting a processing furnace and a component which is welded to it can be reduced and replacement of component can be facilitated. SOLUTION: The substrate processing apparatus is provided with the reaction tube 203 of made of quartz, a heating means 207 for heating a substrate 200 in the reaction tube 203, gas supply means 232a and 232b, and an exhaust means 246. In this case, a buffer chamber 237 before supply of the reaction tube 203 with a treatment gas is formed, by welding a buffer chamber component 330 of quartz to the reaction tube 203 at plural discrete points. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006066593(A) 申请公布日期 2006.03.09
申请号 JP20040246589 申请日期 2004.08.26
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 SHIMA NOBUHITO;TSUCHIYA MASATERU
分类号 H01L21/31;C23C16/44 主分类号 H01L21/31
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