| 摘要 |
PROBLEM TO BE SOLVED: To provide the bonding device of a thermocompression bonding type with simple structure and at low cost, while making it possible that a circuit element is mounted on the circuit board, by securing conductive connection via an electric conductive bonded material consisting of thermosetting resin without generating thermal deformation such as warpage. SOLUTION: The bonding device comprises a press surface 21a of a press head section 21 formed in a curved recess side in a thermocompression bonding tool 20, and the support side 12a of a compression support 12 in a stage 10 formed in a curved convex side. In this bonding device, a liquid crystal panel work W is set wherein a semiconductor chip 6 is arranged via an anisotropy electric conductive binder 7 in the predetermined position of the substrate extending section 3a of a liquid crystal display element 1. Thus, a heater 23 embedded under a base body 22 of the thermocompression bonding tool 20 is turned on so that the press surface 21a may be heated for heating the surface of semiconductor chip 6 as well as performing thermocompression bonding. COPYRIGHT: (C)2006,JPO&NCIPI
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