发明名称 ELEMENT SUBSTRATE WITH UNCOATED PART
摘要 PROBLEM TO BE SOLVED: To provide an element substrate which prevents a coating agent from outflow into a circuit substrate side while preventing the coating agent from outflow into an unapplied part. SOLUTION: In a substrate 101, a notch 114 used as a first outflow prevention means is formed so as to prevent a sealing resin 105 from flowing into a circuit substrate 102 side. Further, in the substrate 101, a recess 115 used as a second outflow prevention means is formed in electrodes 107, 108 provided in the substrate 101 so as to prevent a sealing resin from flowing into an element 103 (uncoated part). In the recess 115, connecting electrodes 107, 108 for connecting to wires 104. Consequently, the outflow of the sealing resin 105 is prevented from flowing into the circuit substrate 102 side, and from flowing into the element 103 (uncoated part). COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006066558(A) 申请公布日期 2006.03.09
申请号 JP20040246047 申请日期 2004.08.26
申请人 CITIZEN MIYOTA CO LTD 发明人 NAKAZAWA TOMOYUKI
分类号 H01L23/28 主分类号 H01L23/28
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