发明名称 Apparatus for processing substrates
摘要 A processing apparatus for substrates that include a plurality of individual substrates having a photo-curable adhesive layer interposed therebetween, including a mounting table, an irradiating device that irradiates the substrates, and a control device that controls the deflection of the substrates (X) while the individual substrates are bonded together by photo-curing the adhesive. The control device calculates a temperature difference DeltaT between the temperature Th of the mounting table and the temperature Td of the substrates before curing, finds a deflection difference DeltaX between the deflection X of the substrates after curing and the target deflection setting value Xt, finds a temperature Tc by calculating Tc=DeltaT-MxDeltaX using the constant of proportionality M; and controls the temperatures of at least one of the substrates before curing and the mounting table according to the temperature Tc such that Tc=Th-Td.
申请公布号 US2006048895(A1) 申请公布日期 2006.03.09
申请号 US20050253029 申请日期 2005.10.17
申请人 ORIGIN ELECTRIC COMPANY, LIMITED 发明人 SUZUKI TAKAYUKI;NAKAMURA MASAHIRO;WAKAHIRA TSUYOSHI;KOBAYASHI HIDEO
分类号 B32B37/00;B32B37/12;B32B41/00;G05G15/00;G11B7/26 主分类号 B32B37/00
代理机构 代理人
主权项
地址