发明名称 |
Apparatus for processing substrates |
摘要 |
A processing apparatus for substrates that include a plurality of individual substrates having a photo-curable adhesive layer interposed therebetween, including a mounting table, an irradiating device that irradiates the substrates, and a control device that controls the deflection of the substrates (X) while the individual substrates are bonded together by photo-curing the adhesive. The control device calculates a temperature difference DeltaT between the temperature Th of the mounting table and the temperature Td of the substrates before curing, finds a deflection difference DeltaX between the deflection X of the substrates after curing and the target deflection setting value Xt, finds a temperature Tc by calculating Tc=DeltaT-MxDeltaX using the constant of proportionality M; and controls the temperatures of at least one of the substrates before curing and the mounting table according to the temperature Tc such that Tc=Th-Td.
|
申请公布号 |
US2006048895(A1) |
申请公布日期 |
2006.03.09 |
申请号 |
US20050253029 |
申请日期 |
2005.10.17 |
申请人 |
ORIGIN ELECTRIC COMPANY, LIMITED |
发明人 |
SUZUKI TAKAYUKI;NAKAMURA MASAHIRO;WAKAHIRA TSUYOSHI;KOBAYASHI HIDEO |
分类号 |
B32B37/00;B32B37/12;B32B41/00;G05G15/00;G11B7/26 |
主分类号 |
B32B37/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|