| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce as much as possible the distance of electrical connection between the electrode terminal of a semiconductor element, formed on one side surface side of the semiconductor substrate and the pad for external connection terminal, formed at the other surface side of the semiconductor substrate. <P>SOLUTION: In the semiconductor device, a pattern 14 electrically insulated from the semiconductor substrate 10 and extended from the electrode terminal 12a of the semiconductor element 12 and an insulating layer 16 covering the semiconductor element 12 and pattern 14, are formed in the side of the semiconductor element forming surface of the semiconductor substrate 10 formed in one surface side of the semiconductor element 12; while a pad 32 for external connection terminal electrically connected to the pattern 14 is formed in the other surface side of the semiconductor substrate 10. In the semiconductor device, a recess open to the other surface side of the semiconductor substrate 10 and exposing the side surface of semiconductor substrate at the region near the semiconductor element of the pattern 14 at the bottom surface is connected, at one end, to an insulating layer 22 covering the sidewall surface and the side surface of the semiconductor substrate of the pattern 14. Moreover, the recess is filled with a column type conductor 30 formed of a metal material connected to the pad 32 formed covering the aperture thereof at the other end. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
