发明名称 CHEMICAL MECHANICAL POLISHING METHOD FOR DIAMOND SURFACE
摘要 <P>PROBLEM TO BE SOLVED: To solve problems such as an increase in cost due to polishing step using a special device because chemical polishing of diamond thin film requires high-temperature environment or special reaction, complicated work step due to polishing only in a vacuum environment, toxicity of abrasive grains to workers in working environment, and environmental load of exhaust based on current environment regulations (ease of processing). <P>SOLUTION: An artificial diamond thin film or a thin plate is immersed in a polishing liquid wherein alumina abrasive grains are dispersed in water, and a lapping machine is rotated to graze the surface of the thin film or thin plate of the artificial diamond by the alumina abrasive grains. Such a method is used to polish the surface of diamond chemically and mechanically. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006066554(A) 申请公布日期 2006.03.09
申请号 JP20040245928 申请日期 2004.08.25
申请人 JAPAN SCIENCE & TECHNOLOGY AGENCY 发明人 TAKAHASHI YUTAKA
分类号 H01L21/304;B24B1/00;B24B37/00;B24B37/005;B24B37/04;B24B37/07 主分类号 H01L21/304
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