| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size, thin, lower cost or the like, without causing malfunctions, deterioration of the characteristics of a device functional portion, or the like, in an electronic component equipped with an electronic device requiring a sealing structure, in which an upper part of the device functional portion is made to be in a hollow state. SOLUTION: The electronic component 10 includes the electronic device 13, having an electrode 12 for external connection, and the device functional portion 11 which are formed on an identical face. The electronic device 13 is arranged facing a substrate 14 so that space is formed between the device and the device functional portion 11, and a connecting portion is constituted by the electrode 12 for external connection and a surface wiring layer 15. The periphery of the connecting portion is insulated and sealed by a resin-sealing portion so that space between the electronic device 13 and the substrate 14 is kept airtight. The resin sealing portion is constituted of, for example, the curing material of a component of highly viscous epoxy resin, of which the viscosity at 25°C ranges is 300 to 1500 Pa s. COPYRIGHT: (C)2006,JPO&NCIPI
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