发明名称 SEMICONDUCTOR MANUFACTURING DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To manufacture a film of predetermined film thickness at good reproducibility in deposition with a batch type CVD device, by suppressing variations in film thickness that depends on the number of product wafers. SOLUTION: A deposition device 100 comprises a growth oven 101 in which a product wafer 107 and dummy wafer 109 are stored, a boat 105 where the product wafer 107 and the dummy wafer 109 are set, and a heater 111 provided along an oven wall 103, outside the growth oven 101. The deposition device 100 also comprises a gas supply system comprising a high-k material supply pipe 113 and an SiO<SB>2</SB>material supply pipe 115, and a control unit 121 which controls supplying of gas from the gas supply system to the growth oven 101. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006066511(A) 申请公布日期 2006.03.09
申请号 JP20040245306 申请日期 2004.08.25
申请人 NEC ELECTRONICS CORP;NEC CORP 发明人 YAMAMOTO ICHIRO;WATABE KOJI
分类号 H01L21/31;C23C16/34;C23C16/40;C23C16/52;H01L21/02;H01L21/316;H01L29/78 主分类号 H01L21/31
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