发明名称 FAST CURING ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a fast curing adhesive composition having excellent fast curability, storage stability and adhesiveness and suitable for adhesives and sealing materials. SOLUTION: The adhesive composition contains (A) an organic polymer having a crosslinkable silyl group expressed by SiX<SB>3</SB>(X is hydroxyl group or a hydrolyzable group; three X groups may be the same or different) and (B) a dialkyl organic tin compound having 5-20C alkyl groups. The dialkyl organic tin compound (B) is preferably a dioctyl organic tin compound and/or a didodecyl organic tin compound. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006063321(A) 申请公布日期 2006.03.09
申请号 JP20050198571 申请日期 2005.07.07
申请人 CEMEDINE CO LTD 发明人 SAITO ATSUSHI;KUROSAWA SHIGERU;OKAMURA NAOMI;OSHIMA YUICHI
分类号 C09J201/10;C09J11/06;C09J143/04;C09J171/02;C09J183/06;C09K3/10 主分类号 C09J201/10
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