发明名称 Flexible connection substrate and folding electronic apparatus
摘要 A flexible connection substrate includes a first flexible substrate and a second flexible substrate. The first flexible substrate electrically connects first signal lines that are formed on a first circuit substrate to second signal lines that are formed on a second circuit substrate. The second flexible substrate is a flexible substrate for grounding, has a planar shape that is substantially the same as the first flexible substrate, and contains a conductive material throughout. The second flexible substrate connects to any of a plurality of grounding points that are formed on the first circuit substrate and any of a plurality of grounding points that are formed on the second circuit substrate. The first flexible substrate and the second flexible substrate are bonded to each other on one surface.
申请公布号 US2006050490(A1) 申请公布日期 2006.03.09
申请号 US20050197337 申请日期 2005.08.05
申请人 NEC CORPORATION 发明人 OOTANI TAKUMI
分类号 H05K5/00;H05K7/06 主分类号 H05K5/00
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