| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem that the complex setting of image processing parameters is required when a pattern profile is evaluated or an inspection position is detected by performing pattern patching between the image of a semiconductor device photographed by a scanning electron microscope and design data of the semiconductor device. <P>SOLUTION: The pattern matching device can be mounted to a scanning electron microscope system, for example, and extracts a pattern included in an SEM image with high precision by altering a filter parameter by the utilization of image processing parameters related to the width of a white band obtained intuitively from the SEM image thus matching design data and a pattern. It can be utilized in the coincidence calculation of the pattern of a semiconductor device photographed by an SEM and the design data, the detection of a position matching the pattern of the SEM image from the design data, and the detection of a position matching the pattern of the design data from the SEM image. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
