PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To allow a wiring pattern to be easily formed without reducing the thickness of the wiring pattern when a conductive metal layer is removed so as to efficiently manufacture a high-reliability printed circuit board reduced in variation in insulation resistance caused by migration. SOLUTION: A substrate film comprises a substrate metal layer and a conductive metal layer which are sequentially formed on at least one surface of an insulating film. On the surface of the conductive metal layer, a desired masking pattern is formed by exposing and developing a photosensitive resin layer. After selectively etching mainly the conductive metal layer by using the pattern as a masking material, an exposed substrate metal layer is removed by being continuously soft-etched while leaving the masking material in place. Subsequently, the formed wiring pattern is treated with a solution which contains an organic compound having a reductive property. COPYRIGHT: (C)2006,JPO&NCIPI