| 摘要 |
PROBLEM TO BE SOLVED: To simplify a burn-in process and to reduce cost in a surface-emission wafer, and a manufacturing method and a burn-in method of the wafer. SOLUTION: The surface-emission wafer is provided with a substrate 10 and a plurality of surface-emission elements 1 formed on the substrate 10. Each surface-emission element 1 includes a light emitting element 20, first and second electrodes 30 and 32 driving the light emitting element 20 and a rectifying element 40. The rectifying element 40 is connected in parallel between the first and the second electrodes 30 and 32, and has a rectifying operation in a direction opposite to the light emitting element 20. A plurality of the surface-emission elements 1 are connected in series in a direction with which forward directions of the light emitting elements 20 are matched. COPYRIGHT: (C)2006,JPO&NCIPI
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