| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board equipped with a circuit pattern which is made small in resistivity, capable of carrying a large current even if it is fine, made small in scale, and well integrated. SOLUTION: The flexible circuit board 10 is equipped with circuit patterns 20-1 to 20-7 formed on the surface of a flexible, insulating and synthetic resin film 11. At least, the circuit patterns 20-3 to 20-6 out of the circuit patterns 20-1 to 20-7 are composed of fused-circuit patterns which are each provided with a metal particulate-fused conductive film where metal particulates are fused together by heating the synthetic resin film 11, on which paste containing the metal particulates of silver, silver compound, copper or copper compound has been applied at temperatures of 140 to 250°C. COPYRIGHT: (C)2006,JPO&NCIPI
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