MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING FLIP CHIP BONDING, SEMICONDUCTOR DEVICE, AND FORMING METHOD OF FLIP CHIP BONDING PART OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which enhances the durability and the quality of the semiconductor device to be manufactured and uses flip flop bonding. SOLUTION: This method comprises a bump bonding step of bonding a bump 12 on a substrate 15 formed with a first electrode thin film 14, a flip-flop bonding step of bonding a semiconductor chip 11 to the substrate 15 via the bump 12, and a heat treating step of at least heating or cooling after the flip-flop bonding step. In the method for manufacturing a semiconductor device, the flip flop bonding is used which spreads a material for forming the bump 12 in order to finally terminate the spread of the material for forming the bump 12 in the heat treating step only in the first electrode thin film 14 in the flip-flop bonding step until a first condition that a depth d2 which spreads the material for forming the bump 12 is smaller than the thickness T of the first electrode thin film 14. COPYRIGHT: (C)2006,JPO&NCIPI