| 摘要 |
PROBLEM TO BE SOLVED: To provide a jet type soldering device which can prevent formation of a solder bridge even in a lead component of a narrow pitch. SOLUTION: The device has a nozzle 55 and jet generation means 52, 52A for jetting molten solder 3 from the blowoff opening 55a of the nozzle. It also has a plurality of pins 7 aligned along the jet direction of the molten solder in the blowoff opening, and an elevating means 8 for moving a plurality of pins up and down. In soldering, the elevating means moves a plurality of pins up to a position near the lead 2a of a lead component 2 which passes through a printed substrate 1 to be soldered, and in finishing of soldering, it controls the position of a plurality of pins to lower a plurality of pins to a position isolated from the lead after the printed substrate and the lead remove from molten solder. COPYRIGHT: (C)2006,JPO&NCIPI
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