| 摘要 |
PROBLEM TO BE SOLVED: To provide a drop shock buffer structure for preventing dislocations in four directions of an electronic component which occur at the time of shock, and preventing deformation of a lead wire of a coil due to shock, by effectively absorbing and dispersing shock which occurs in the electronic component such as the coil on a circuit board by drop and the like. SOLUTION: A plurality of first shock buffer members 5 are individually disposed between the coils 3 and the circuit board 2. A lid member 1 is arranged opposite to the circuit board 2 and is disposed to sandwich the coils 3. One second shock buffer member 41 which is arranged in common to a plurality of the coils 3 is arranged between the lid member 1 and the coil electronic components 3. COPYRIGHT: (C)2006,JPO&NCIPI
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