| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-bond thin blade grinding wheel, surely preventing the occurrence of burrs over a long period of time when used in cutting an electronic material part such as QFN and IrDa, reducing an idling time during cutting work, and having conductivity without addition of carbon or the like. SOLUTION: This resin-bond thin blade grinding wheel includes a thin blade abrasive grain layer 1 in which WC powder 4 is dispersed in a resin binder phase 2 holding superabrasive grains 3, and the content of WC powder 4 in the thin blade abrasive grain layer 1 is 10 to 45 vol%. COPYRIGHT: (C)2006,JPO&NCIPI
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