发明名称 SOLDER ALLOY
摘要 PROBLEM TO BE SOLVED: To provide a solder alloy capable of preventing deterioration in the tip of a soldering iron. SOLUTION: This solder alloy has a composition containing, by weight, 0.3 to 3% Cu, 0.01 to 0.1% Fe and 0.001 to 0.004% Ga, and the balance Sn with inevitable impurities. Further, at least one or more kinds selected from 0.1 to 4.5% Ag, 0.05 to 0.5% Ni, 0.1 to 3.0% Bi and 0.001 to 0.01% Mn are added to the solder alloy, thus its mechanical properties are improved. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006061914(A) 申请公布日期 2006.03.09
申请号 JP20040243680 申请日期 2004.08.24
申请人 NIHON ALMIT CO LTD 发明人 SAWAMURA SADA;IGARASHI GAKUO;AZUMA HIROSHI
分类号 B23K35/26;C22C13/00;C22C13/02 主分类号 B23K35/26
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