| 摘要 |
An integrated semiconductor circuit comprises a substrate with a circuit, a plurality of wiring planes that are isolated from one another and from the substrate by insulator layers, and a signal path for the circuit in the substrate and/or the wiring planes. A first contact terminal, which is formed from a stack of metal areas in a plurality of the wiring planes, is designed for connecting the signal path to an external signal source or an external signal receiver during a test of the integrated semiconductor circuit. A second contact terminal, which is formed from a metal area or from a stack of metal areas in a plurality of wiring planes, is designed for connecting the signal path to an external signal source or an external signal receiver during normal operation of the integrated semiconductor circuit. The distance between the metal area or the bottommost metal area of the stack of the second contact terminal and the substrate is greater than the distance between the bottommost metal area of the stack of the first contact terminal and the substrate.
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