发明名称 Printed wiring board
摘要 A printed wiring board comprises the insulating layer 11 ( 12 ); at least one resistance element 31 , ( 312 ) comprising a metal as a main component has 0.5 to 5 mum of a roughened surface in an arithmetic means height in the one surface, in -Z direction, and 5% to 50% of the arithmetic mean height in average thickness, which is embedded close to a surface on one side of the insulating layer 11 and a conductive pattern wired surface is composed of the one surface of the resistance element and the one side of the insulating layer 11 ; and the conductive pattern 351 ( 352 ), arranged on the conductive pattern wired surface, is connected to the terminal of the resistance element 31 <SUB>1 </SUB>( 31 <SUB>2</SUB>). With this structure, it is provided the printed wiring board comprising the resistance element having an accurate and stable resistance value in a broader resistance value range.
申请公布号 US2006049509(A1) 申请公布日期 2006.03.09
申请号 US20050253734 申请日期 2005.10.20
申请人 IBIDEN, CO., LTD. 发明人 TSUKADA KIYOTAKA;IWATA TOSHIMASA;NINOMARU TERUMASA;SUGIURA TAKAMICHI
分类号 H01L23/04;H05K1/16;H05K3/10;H05K3/46 主分类号 H01L23/04
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