| 摘要 |
A stacked die configuration for use in an IC package includes a first IC die mechanically coupled to a substrate material. Mechanically coupled to the first IC die is an interposer having an aperture adapted to receive a second IC die. Mechanically coupled to the first IC die and fitting within the aperture of the interposer is a second IC die. As a result, both the overall height of the IC package and the length of the bond wires connecting each of the members of the stacked die configuration may be reduced.
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