| 摘要 |
<p>The present invention relates to a retaining ring which prevents a wafer from slipping out during wafer polishing in a chemical mechanical polishing apparatus. The retaining ring according to the invention comprises a plurality of retaining pieces to prevent a wafer from slipping out during polishing by supporting a side surface of the wafer, and a substantially annular base ring where the plurality of retaining pieces are attached.</p> |
