HERSTELLUNGSVERFAHREN FÜR VERKAPSELTE HALBLEITERANORDNUNGEN

摘要

A method for manufacturing encapsulated semiconductor devices, including rotary speed sensing devices, by using a lead frame. Electrical terminals of the semiconductor device are electrically connected to electrical leads from the lead frame. The semiconductor device is encapsulated in a plastic housing which is also connected to positioning posts located on the lead frame. The electrical leads are disconnected from the lead frame, permitting additional processing of the semiconductor device, including testing.