| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed wiring board for high speed transmission and miniaturized equipment by preventing malfunction due to signal multiple reflections or breakage of a transmission/reception device. <P>SOLUTION: A high speed transmission path is provided across a plurality of inner layers, and the high speed transmission path is provided with a resistor having a width similar to the wiring width of the high speed transmission path. A plurality of high speed transmission paths are provided across a plurality of inner layers, and a resistor is connected in the middle of the plurality of high speed transmission paths through hole. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
