| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing device capable of selectively and easily peeling resin sticking on a stage or a tool in a short time and improving the yield of a semiconductor device, and to provide a mounting method for the semiconductor device. <P>SOLUTION: The manufacturing device is equipped with a 1st holder 11 which holds a semiconductor element 41, a 2nd holder 13 holding a substrate 51 joined with the semiconductor element 41 across bump electrodes 45a and 45b connected to the semiconductor element 41 and a sealing material 60 arranged around the bump electrodes 45a and 45b, an ultrasonic vibration applying mechanism 30 which applies ultrasonic vibration to at least one of the 1st holder 11 and the 2nd holder 13, and a light irradiation mechanism 20 which irradiates portions of sealing materials 61a and 61b sticking on at least one of the 1st holder 11 and the 2nd holder 13 as the semiconductor element 41 and the substrate 51 are joined together with ultraviolet light. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
