发明名称 CUSHION FOR PACKING DISK SUCH AS SEMICONDUCTOR WAFER
摘要 PROBLEM TO BE SOLVED: To provide cushion equipment selectively secured within a container and packing a disk such as a semiconductor wafer. SOLUTION: A cushion 40 includes a plurality of cushion members, each having two ends supported by a base, respectively. The cushion member has a stepped configuration between the two ends and angles between neighboring substantially liner portions of the stepped configuration change as the cushion member flexes in response to the engagement with a semiconductor within the container. Further, a contacting portion 90 the position of which has been adjusted and which is an angle between about 65°and about 180°apart is provided near the vertex between two neighboring linear portions of the cushion member. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006066911(A) 申请公布日期 2006.03.09
申请号 JP20050240661 申请日期 2005.08.23
申请人 EPAK INTERNATL INC 发明人 HAGGARD CLIFTON C;THOMAS JAMES R;CHEN SONG PING;LIU RU ZHENG;KHOO MAO SHI
分类号 H01L21/673;B65D85/57;B65D85/86 主分类号 H01L21/673
代理机构 代理人
主权项
地址