| 摘要 |
A flex circuit populated with integrated circuits on one or both sides and in one or more fields along the flex circuitry is wrapped about an edge of a supporting substrate. In preferred embodiments, the substrate is thermally conductive material. One side of the flex circuitry has a connective facility implemented in a preferred embodiment with edge connector contacts such as those that would allow the resulting module to be inserted into an expansion socket. In a preferred embodiment, integrated circuits (preferably memory CSPs) and any accompanying circuitry or buffers are arranged on one or both sides of a flexible circuit. In some embodiments, one or more thermal sensors or other indicators are thermally coupled to the module substrate.
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