发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a very fine SOI-MOS transistor and a method of manufacturing it. SOLUTION: A support substrate 1 is sequentially coated with a thick oxide film 2, a semiconductor film 31 insulated from outside, and a thin oxide film 21 and a thin SOI layer 3 which act as a diffusion prevention insulating film. In the SOI layer 3, drain diffusion layers 9 and 10 and source diffusion layers 8 and 11 of the MOS transistor are formed. In the thin oxide film 21 below a channel of the MOS transistor, a heavily doped region 38 which has the same conductivity type as the channel is formed. A short channel effect of the MOS transistor is restrained to improve source-drain breakdown voltage and to decrease drain junction capacitance. Thereby, very fine MOS transistor can be formed in the SOI layer. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006066928(A) 申请公布日期 2006.03.09
申请号 JP20050289699 申请日期 2005.10.03
申请人 RENESAS TECHNOLOGY CORP 发明人 HORIUCHI KATSUTADA
分类号 H01L27/12;H01L21/02;H01L21/336;H01L21/76;H01L21/762;H01L29/786 主分类号 H01L27/12
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