| 摘要 |
PROBLEM TO BE SOLVED: To provide an excellent heater in which a temperature difference in a wafer face is set so as to be 0.4°C or lower, the change quantity of the resistance value of a resistance heating body is made small, and the temperature variation of a wafer is made small even when heating and cooling are repeated, and a wafer heating device using the heater. SOLUTION: This heater is provided with a band-shaped resistance heating body on the surface of a plate-shaped body, and a groove which is almost parallel with the longitudinal direction of the band of the resistance heating body. The resistance heating body is constituted of the composite material of an insulating composition and a conductive composition, and the density of the conductive composition on the surface of the groove is set so as to be smaller than the density of the internal conductive composition of the resistance heating body. COPYRIGHT: (C)2006,JPO&NCIPI
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