| 摘要 |
PROBLEM TO BE SOLVED: To provide a package with high joint strength between a metallic heat dissipation board and a ceramic frame and sufficiently resistant to bending stress by external force. SOLUTION: The package 1 includes the metallic heat dissipation board 2 approximately rectangular in a plan view, a brazing material layer 12 formed on the upper surface of the heat dissipation board 2, a metallized layer 10 formed on bottom faces 7c and 8c of the ceramic frame 6 approximately rectangular in a plan view and in contact with brazing material layer 12, and an insulator 14 formed on the outermost surface 11 of the metallized layer 10 along the end rim of the layer 10. COPYRIGHT: (C)2006,JPO&NCIPI
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