| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component storing package and an electronic device, reduced in the probability of separating a metallized layer from an insulating substrate or the like, and a multi-pattern wiring board reduced in the probability of separating the metallized layer from the insulating substrate or the like without reducing partitioning property extremely. SOLUTION: The electronic device is provided with the insulating substrate 101 having a recess 105 for receiving an electronic component on the upper surface 104 thereof, a metallized layer 102 formed on the periphery of the recess 105 on the upper surface 104 of the insulating substrate 101, and a metal frame 103 connected to the metallized layer 102. The metallized layer 102 is provided with a first region 102a surrounding the recess 105, and a plurality of second regions 102b projected from the first region 102a toward the outer rim of the insulating substrate 101. COPYRIGHT: (C)2006,JPO&NCIPI
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