| 摘要 |
PROBLEM TO BE SOLVED: To provide a compound substrate along with its manufacturing method capable of suppressing electric resistance at a terminal part, for a reduced cost. SOLUTION: A compound substrate 10 comprises a first substrate 1 where a conductive part 4 is formed on a base material 3, and a second substrate 2 where a conductive part 6 is formed on a base material 5 with the conductive parts 4 and 6 of the substrates 1 and 2 jointed together at terminal parts 9. Relating to the terminal part 9, connection particles 11 of metal are sandwiched between the conductive parts 4 and 6, and the longitudinal section of an interface 12 between the connection particles 11 and the conductive parts 4 and 6 is formed to be annular. COPYRIGHT: (C)2006,JPO&NCIPI
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