发明名称 Atomic layer deposition of metal oxynitride layers as gate dielectrics
摘要 A metal oxynitride layer formed by atomic layer deposition of a plurality of reacted monolayers, the monolayers comprising at least one each of a metal, an oxide and a nitride. The metal oxynitride layer is formed from zirconium oxynitride, hafnium oxynitride, tantalum oxynitride, or mixtures thereof. The metal oxynitride layer is used in gate dielectrics as a replacement material for silicon dioxide. A semiconductor device structure having a gate dielectric formed from a metal oxynitride layer is also disclosed.
申请公布号 US2006051925(A1) 申请公布日期 2006.03.09
申请号 US20050253542 申请日期 2005.10.19
申请人 AHN KIE Y;FORBES LEONARD 发明人 AHN KIE Y.;FORBES LEONARD
分类号 H01L21/336;H01L21/28;H01L21/31;H01L21/314;H01L21/3205;H01L21/8242;H01L29/51 主分类号 H01L21/336
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