发明名称 METHOD OF MANUFACTURING MULTILAYER WIRING BOARD, ELECTRON DEVICE, AND ELECTRONIC APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To allow controlling the height of a conductor post contributing to productivity as well. <P>SOLUTION: On a substrate P, the board has at least two layers, conductor layers E1 and E2, an interlayer dielectric 14 provided between the conductor layers E1 and E2, and a conductor post T for electrical continuity between the conductor layers E1 and E2. The conductor post T is formed by repeating a process for applying a droplet containing conductive substance; a process for providing optical energy to the droplet which is applied; and a process for laminating, or applying, the next droplet on the droplet which is applied with optical energy. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006066494(A) 申请公布日期 2006.03.09
申请号 JP20040244842 申请日期 2004.08.25
申请人 SEIKO EPSON CORP 发明人 MIURA HIROTSUNA
分类号 H05K3/46 主分类号 H05K3/46
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