发明名称 METAL-CERAMIC BONDING SUBSTRATE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a metal-ceramic bonding substrate in a multi-layered structure and a manufacturing method thereof that deter bonding voids from being formed and have high positioning information and reliability. SOLUTION: In the manufacturing method of a metal-ceramic bonding substrate in the multi-layered structure wherein a plurality of metal plates (10, 14, 18 and 24) are bonded across ceramic substrates (12, 16, and 20), the plurality of ceramic substrates (12, 16 and 20) are arranged in a mold apart from one another, and molten metal is poured into the mold to come into contact with the ceramic substrates (12, 16, and 20) and then cooled to be solidified, thereby forming the metal plates (10, 14, 18, and 24) on the respective ceramic substrates (12, 16, and 20). COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006066595(A) 申请公布日期 2006.03.09
申请号 JP20040246606 申请日期 2004.08.26
申请人 DOWA MINING CO LTD 发明人 OSANAI HIDEYO
分类号 H01L23/12;C04B37/00;H05K1/02;H05K3/46 主分类号 H01L23/12
代理机构 代理人
主权项
地址