| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper-clad laminate for a multi-layer printed wiring board for highly precisely maintaining the shape of a via hole, and for satisfactorily packing resin between circuits, and to provide a multi-layer printed wiring board which is excellent in insulation and its manufacturing method by manufacturing the multi-layer printed wiring board by using the copper-clad laminate for the multi-layer printed wiring board. SOLUTION: This copper-clad laminate for a multi-layer printed wiring board is configured so that a copper foil, a hard insulating layer formed by hardening thermosetting resin so as not to be softened in a temperature range ranging from 100°C to 400°C, an adhesive resin layer formed so as to be temporarily melted in the temperature range and a protection film can be arranged and integrated in this order. The adhesive resin layer is configured so that the rate of minimum melding viscosity (A) measured by a melting viscosity measuring unit after heat treatment in 100°C and 90 minutes to minimum melting viscosity (B) before the heat treatment can satisfy (a) formula: 1≤(A/B)≤10. COPYRIGHT: (C)2006,JPO&NCIPI |
