| 发明名称 |
LASER CUTTING METHOD AND ARRANGEMENT FOR PERFORMING SAID METHOD |
| 摘要 |
<p>The present invention relates to a laser cutting method, for forming a score in a substrate material. At least one pulsed laser beam impinges on a substrate material for melting at least a fraction of said substrate material, and said score is formed by moving the substrate material relative to the at least one pulsed laser beam. The laser beam has an intensity and a pulse duration such that at least a part of said molten fraction is vaporized, for exerting a force on said molten fraction by said vaporized part, for substantially removing said molten fraction from said score. The invention further relates to an arrangement for performing the laser cutting method.</p> |
| 申请公布号 |
WO2006006850(A9) |
申请公布日期 |
2006.03.09 |
| 申请号 |
WO2005NL00489 |
申请日期 |
2005.07.07 |
| 申请人 |
. ADVANCED LASER SEPARATION INTERNATIONAL (ALSI) B.V;CHALL, HANS, PETER;MAI, TUAN, AHN |
发明人 |
CHALL, HANS, PETER;MAI, TUAN, AHN |
| 分类号 |
B23K26/00;B23K26/38;H01L21/00;(IPC1-7):B23K26/38 |
主分类号 |
B23K26/00 |
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