| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for dividing a wafer into chips surely and finely and a die bonder using the dividing method. SOLUTION: While the tape 3 of a wafer ring 5 and a wafer 1 are expanded by an expanding mechanism 20 in the die bonder, a squeegee 8 as a linear pressing body is pressed down to the wafer from the rear surface of the tape 3, and moved in parallel along the rear surface of the tape to divide the wafer 1 in sequence from a planned dividing line 1a. The planned dividing line 1a can use a reformed area with cracks formed inside the wafer 1 by a laser dicing method, and a half-cut dicing groove formed on the surface of the wafer. COPYRIGHT: (C)2006,JPO&NCIPI |
