| 摘要 |
PROBLEM TO BE SOLVED: To provide a simple and inexpensive method of removing the whole part or a part of a plating tail after a trace is formed on a substrate by executing an electroplating treatment. SOLUTION: By using a laser, the whole part or a part of some of a plating tail is removed, or the whole part of the plating tail, that is, all of a plurality of plating tails or only some of the plurality of plating tails are removed. Preferably, each of the plating tails connected to a high-speed input/output (I/O) is partially or completely removed by the laser. By removing only the plating tail of the trace that is required, a manufacturing cost of a substrate and a package can be suppressed. COPYRIGHT: (C)2006,JPO&NCIPI |
