| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which heat dissipation can be enhanced by decreasing the number of components existing in a passage for transmitting heat generated by a semiconductor element 11. SOLUTION: The semiconductor element 11 is arranged to be held between a first metal base substrate 12 and a second metal base substrate 13. The first metal base substrate 12 and the second metal base substrate 13 are thermally connected with the semiconductor element 11. Refrigerant circulation holes 121 and 131 are formed in the metal base sections 12a and 13a of the first and second metal base substrates 12 and 13. COPYRIGHT: (C)2006,JPO&NCIPI |
