PREPREG, METHOD FOR PRODUCING THE SAME, LAMINATED SHEET AND PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a prepreg, a laminated sheet and a printed circuit board prepared by using an epoxy resin composition having excellent dispersibility of varnish and high thermal conductivity at the same time. SOLUTION: The prepreg is produced by impregnating an epoxy resin composition containing an epoxy resin and a curing agent in a fibrous sheet substrate and semicuring the composition. The epoxy resin is an epoxy resin compound having a molecular structure expressed by formula (1) [R is an alkyl (a≤4C aliphatic hydrocarbon group), acetyl or a halogen; and n is 0-5 on an average] and contains an inorganic filler having a thermal conductivity of≥20 W/m×K in an amount of 10-900 pts. vol. based on 100 pts. vol. of the solid component of the resin. The laminated sheet and the printed circuit board are produced by using the prepreg. COPYRIGHT: (C)2006,JPO&NCIPI