| 摘要 |
PROBLEM TO BE SOLVED: To provide a bare chip mounting apparatus and a bare chip mounting method for preventing an adhesive from intruding between a bare chip and a bonding head without the need for a control apparatus for gas temperature and gas ejection, a gas storage and supply or like processing device, and gas flow adjustment. SOLUTION: A pressurizing tool 2 adsorbs and supports the bare chip 4, and mounts the supported bear chip 4 to a mount position on a board 6 to which the adhesive 5 is coated. When the pressurizing tool 2 adsorbs and supports the bare chip 4, a sheet 3 is inserted between the pressurizing tool 2 and the bare chip 4. COPYRIGHT: (C)2006,JPO&NCIPI
|
