发明名称 JOINT STRUCTURE, JOINTING METHOD AND JOINTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a joint structure, a jointing method and a jointing apparatus capable of reducing the post-cure internal residual stress due to hardening and contraction irrespective of bonding forms and the like and avoiding the slippage with time of parts, with a simple constitution of apparatuses. SOLUTION: In jointing an adherend 1 and an adherent object 2 with an energy-curable adhesive 3, air bubbles 4 are charged in the adhesion area in a predetermined density gradient and the progress of the hardening process is varied by stages in the adhesion area. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006062270(A) 申请公布日期 2006.03.09
申请号 JP20040249325 申请日期 2004.08.27
申请人 RICOH CO LTD 发明人 TANEDA YUSUKE;TERU TAROU;OSHIMA HISAYOSHI
分类号 B29C65/52;C09J5/00;C09J201/00 主分类号 B29C65/52
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