发明名称 Heat-expandable microcapsule
摘要 It is an object of the present invention to provide a thermally expandable microcapsule, which can be thermally expanded at low temperatures and in which an expanded microcapsule is resistant to shrink at high temperatures. The present invention pertains to a thermally expandable microcapsule, which contains a shell polymer and a volatile expanding agent becoming gaseous at a temperature not higher than a softening point of said shell polymer, in which said shell polymer contains a nitrile monomer component in an amount 70% by weight or more and a content of an acrylonitrile component in said nitrile monomer component is 40 to 85% by weight, and the volatile expanding agent contains a volatile expanding agent having a branched-chain structure or a cyclic structure in an amount 30% by weight or more.
申请公布号 US2006052512(A1) 申请公布日期 2006.03.09
申请号 US20050534053 申请日期 2005.07.19
申请人 SEKISUI CHEMICAL CO., LTD. 发明人 YAMAUCHI HIROSHI
分类号 C08F8/30;C08J9/32;B01J13/16 主分类号 C08F8/30
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