| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can further prevent the substrate and semiconductor elements from warping. <P>SOLUTION: This semiconductor device consists of a substrate 12, a semiconductor element 14 mounted on the substrate, and a stiffener 16 attached to the rear side of the semiconductor element on the substrate by an adhesive 18. In addition, the thermal expansion coefficient of adhesive 18 is smaller than those of the substrate 12 and stiffener 16, and the vertical elastic modulus of adhesive 18 is 10 GPa or more in a structure, or the thermal expansion coefficient of adhesive 18 is larger than those of the substrate 12 and the stiffener 16, and the vertical elastic modulus of adhesive 18 is 10 GPa or less in a structure. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
