| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate on which semiconductor elements are mounted at high density in a state that an underfill resin having a sufficient thickness can be provided uniformly between the semiconductor elements and the substrate and the elements can be connected accurately to the substrate, and to provide a semiconductor device, a method of manufacturing the substrate, and a method of manufacturing the semiconductor device. <P>SOLUTION: In the substrate, ends of through vias 47 and connection pads 49 on the surface 41A side of a base material 41 are constituted so that the ends and the pads 49 may be flush with the surface 41A. Then a solder resist 57 which exposes the connection pads 49 is provided on the surface 41A of the base material 41 and diffusion preventing films 56 are formed on the connection pads 49. In addition, solder bumps 65 of the semiconductor elements 63 are connected to the connection pads 49 through the diffusion preventing films 56 and the underfill resin 66 is formed in the gap 67 between main bodies 64 of the semiconductor elements 63 and the substrate 40. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
