| 摘要 |
PROBLEM TO BE SOLVED: To form a conductive material layer in areas having a width smaller than that of a droplet without dropping the droplet on the areas. SOLUTION: In forming a wiring pattern, a first area has a first width, and second areas has a second width smaller than the first one. A method for forming the wiring pattern includes a step (A) of dropping a droplet having a diameter smaller than the first width and larger than second width onto the first area to form the conductive material layer covering both first and second areas. The step (A) includes a step (a1) of dropping the droplet to make it land at the position that face the boundary between the first area and the second area. COPYRIGHT: (C)2006,JPO&NCIPI
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